价格：4起
广州市银标贸易有限公司
联系人：赖强平
电话：13922125860
地址：广东省广州市番禺区钟村街道广州市番禺区钟村南国奥园小资天堂1座2层223A室
滤波器EMI屏蔽银胶是一种双组分，
镀银铜填充导电环氧树脂
粘合剂专为应用而设计
必须具有强大的导电性
取得成就。银铜填料
CHO-BOND 360-20具有成本效益
替代纯银填充导电
环氧树脂适用于温和的应用
电导率是可以接受这厚厚的糊状物
适合填充相当大的粘合线
和裂缝（0.004英寸-0.025英寸）的
电器箱和外壳。
可以实现CHO-BOND 360-20的固化
在短短的15分钟内加热到
减少设备停机时间并增加
制造吞吐量。 1：1的重量
混合比使CHO-BOND 360-20易于使用
处理和使用。典型应用包括
EMI，耐受性差的外壳或铸件
通风口和窗户，垂直和头**
圆角应用。
CHO-BOND 360-20 is a two-component,
silver plated copper filled conductive epoxy
adhesive designed for applications where
a strong, conductive electrical bond must
be achieved. The silver copper filler of
CHO-BOND 360-20 provides a cost effective
alternative to pure silver filled conductive
epoxies in applications where moderate
conductivity is acceptable. This thick paste
is good for filling rather large bond lines
and cracks (0.004 inches -0.025 inches) of
electrical boxes and enclosures.
Curing of CHO-BOND 360-20 can be achieved
in as little as 15 minutes with heat to
minimize equipment downtime and increase
manufacturing throughput. The 1:1 weight
mix ratio makes CHO-BOND 360-20 easy to
handle and use. Typical applications include
poorly tolerance enclosures or castings, EMI
vents and windows, and vertical and overhead
fillet applications.